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Mission
The mission of the Microelectronics Center of Excellence (COE) is to advance and
strengthen Harris' core communications business through development of emerging
and disruptive technologies that enable the design and development of power efficient,
miniature communication systems.
Industry Leader in Microelectronics
Harris is recognized as an industry leader in the field of microelectronics. The
Microelectronics COE's highly skilled engineers and scientists provide best-in-class
expertise in fundamental technologies common to all miniature communication systems
and continue to advance the state of the art in technologies such as electronic
interconnect, microfluidics, material science, semiconductors, and Microelectromechanical
Systems (MEMS) resulting in revolutionary improvements in performance, size, power
and weight:
- Embedded Components
- Micropower Generation
- MetaMaterials
- MEMS
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Microfluidics
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Innovation for Tomorrow
Typical communications block diagram, which when utilizing Harris' microelectronics
innovation, yields exceptional performance at a fraction of the size (microscale).
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The Microelectronics COE is making revolutionary improvements in performance, size,
power and weight through collaborative technology developments and process innovations
in:
- Advanced Packaging
- Electronic Interconnect
- Silicon-level Thermal Management
- Die Harvesting & Processing
- Wafer Level Test
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Miniaturization
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Facilities and Resources
The technical research, process development, design, assembly, and test of emerging
technologies for miniaturized electronics and communication systems stem from over
15,000 square feet of in-house laboratories. The COE's advanced research and development
facilities are:
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Advanced Packaging of Sensors.
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- Component Technology
Laboratory
The Component Technology Laboratory provides detailed failure analysis (FA), destructive
physical analysis (DPA), component electrical & thermal screening, and process characterization
utilizing such analytical techniques as Scanning Electron Microscopy (SEM), Energy
Dispersive Spectroscopy (EDS), X-Ray imaging, X-Ray Fluorescence (XRF) plating thickness
measurement, Infrared Thermal Imaging, high magnification digital optical microscopy,
circuit microprobing, micro-sectioning, Particle Impact Noise Detection (PIND),
bond wire pull strength testing, die shear strength testing, and Mil-Standard fine
and gross leak testing of hermetic packages.
- Component Test Laboratory
The Component Test Lab is a state-of-the-art facility for automated electrical testing
and characterization of Digital and Analog Components, including automated electrical
testing at temperature of: wafer at speed (25°C to 125°C), fiber optic assemblies
(-55°C to 125°C), and modules/component testing (-55°C to 125°C).
Other capabilities include PROM and FPGA programming, and infrared Imaging for debugging
MCM, CCB, and PWBs.
- MicroAssembly Laboratory
The Microelectronics Assembly Lab supports development and prototyping of high density
PWB assemblies, MCM / Hybrids assemblies, and MIMIC packages as well as other unique
electronic assembly requirements. Established processes are, solder attachment (automated
and hand solder), bare die attachment, wire and ribbon bonding, flip chip attachment,
die encapsulation, die harvesting, and other specialty assembly processes on PWBs,
Ceramic Substrates, and Flex circuits.
- Substrate Materials Laboratory
The Substrate Materials Lab supports the development and prototyping of new interconnect
technologies and materials focused on miniaturization. The lab has established prototyping
capabilities for Thick Film, Thin Film, and LTCC substrates with processes supporting
thick film printing, photo imageable conductors, via punching, isostatic lamination,
feature routing, laser cutting, diamond sawing, and continuity testing.
- Electrochemical Laboratory
The Electrochemical Laboratory supports engineering in the development of new technologies
by providing low cost breadboards and prototypes with services including Electroforming,
Chemical Milling, PWB fabrication, Electrolytic and Electroless Plating.
Advanced Manufacturing Technology
The Advanced Manufacturing Technology (AMT) MicroLab is the company's resource for
microelectronics level assembly and related advanced packaging technologies. The
AMT accommodates a wide spectrum of requirements ranging from walk-in prototype
assembly services to the volume production of deliverable hardware.
Growth in Education and Advanced Technical Studies
Microelectronic COE advocates continued growth in education and advanced technical
studies by participating in Defense Advanced Research Agency Projects (DARPA), Small
Business Innovative Research (SBIR), University and National Lab activities.
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